A commemorative photo is taken with newly selected companies in the system semiconductor field and officials from the hosting organization who participated in the 'SPIC-hosted DIPS 1000+ LinkUP Selected Companies Networking Day', along with CTO Regina Kim Tae-gyun and Team Leader Lee Seong-min. Photo provided by SPIC.
Reziena, led by CEO Shin Seung-woo, has been selected for the ‘2025 Next-Generation Startup 1000+ DIPS’ program hosted by the Ministry of SMEs and Startups. The company announced plans to work closely with Seoul National University’s System Semiconductor Industry Promotion Center (SPIC) to accelerate the development of semiconductor-based CMUT (Capacitive Micromachined Ultrasonic Transducer) technology.
SPIC will provide selected startups with various growth support programs, including:
Commercialization funding and expert workforce connections
Promotional support to boost brand awareness and demand creation
Free access to ARM IP for semiconductor design and intellectual property acquisition
Multi-Project Wafer (MPW) support for prototype production
As a med-tech company specializing in ultrasound medical technologies such as HIFU and LDM, Reziena aims to pioneer the home beauty device market by developing next-generation devices using semiconductor-based materials and components.
The company stated that participation in the program will serve as a springboard for future growth and help drive innovation in the rapidly expanding global home beauty device sector.
Reziena has already developed advanced home beauty products based on ultrasound medical technology and plans to expand its presence in the mass-market and ODM sectors to meet growing demand.
Source: Global Economic Daily | Published: May 29, 2025
A commemorative photo is taken with newly selected companies in the system semiconductor field and officials from the hosting organization who participated in the 'SPIC-hosted DIPS 1000+ LinkUP Selected Companies Networking Day', along with CTO Regina Kim Tae-gyun and Team Leader Lee Seong-min. Photo provided by SPIC.
Reziena, led by CEO Shin Seung-woo, has been selected for the ‘2025 Next-Generation Startup 1000+ DIPS’ program hosted by the Ministry of SMEs and Startups. The company announced plans to work closely with Seoul National University’s System Semiconductor Industry Promotion Center (SPIC) to accelerate the development of semiconductor-based CMUT (Capacitive Micromachined Ultrasonic Transducer) technology.
SPIC will provide selected startups with various growth support programs, including:
Commercialization funding and expert workforce connections
Promotional support to boost brand awareness and demand creation
Free access to ARM IP for semiconductor design and intellectual property acquisition
Multi-Project Wafer (MPW) support for prototype production
As a med-tech company specializing in ultrasound medical technologies such as HIFU and LDM, Reziena aims to pioneer the home beauty device market by developing next-generation devices using semiconductor-based materials and components.
The company stated that participation in the program will serve as a springboard for future growth and help drive innovation in the rapidly expanding global home beauty device sector.
Reziena has already developed advanced home beauty products based on ultrasound medical technology and plans to expand its presence in the mass-market and ODM sectors to meet growing demand.
Source: Global Economic Daily | Published: May 29, 2025